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INDUSTRY NEWS

GLOBALFOUNDRIES to Acquire IBM's Microelectronics Business »

Tuesday 21st October 2014

Semiconductor Spending to Increase by More Than 11 Percent in 2014 »

Friday 17th October 2014

All change at AMD »

Thursday 16th October 2014

Adoption of SiC & GaN to impact the power electronics industry »

Tuesday 14th October 2014

UMC to Enter a Joint Venture Agreement for Fab in China »

Friday 10th October 2014

New technique offers prospect of silicon detectors for telecommunications »

Thursday 9th October 2014

Quick-change materials break silicon speed limit for computers »

Thursday 9th October 2014

New technology may lead to prolonged power in mobile devices »

Thursday 9th October 2014

New dimension for integrated circuits: 3-D nanomagnetic logic »

Thursday 9th October 2014

New generation of transient electronic devices »

Thursday 9th October 2014

Graphene looks promising as a flexible, low-cost touchscreen solution »

Thursday 9th October 2014

Wafer Shipments Forecast to Increase in 2014, 2015, and 2016 »

Wednesday 8th October 2014

SEMICON Europa 2014 in Grenoble Expands by 40% »

Tuesday 7th October 2014

Semiconductor Sales to Total $338 B in 2014 Says Gartner »

Monday 6th October 2014

Technique offers prospect of silicon detectors for telecommunications »

Friday 3rd October 2014

Infineon Number One for the First Time in MOSFET Segment »

Friday 3rd October 2014

COMPANY NEWS

Retronix Semiconductor Restructures to Accommodate Growing Demand »

Wednesday 22nd October 2014

Plansee expands production in Korea. »

Tuesday 21st October 2014

Siemens to Acquire MES Software Company Camstar, »

Tuesday 21st October 2014

Advantest Launches System for Packaging Inspection »

Monday 20th October 2014

Element Six announce new thermal grade of CVD diamond »

Thursday 16th October 2014

NASDAQ suspends Trading of GT Advanced Technologies' »

Thursday 16th October 2014

Keithley Introduces Smart Device App for Source Measure Unit (SMU) Instruments »

Thursday 16th October 2014

A Sensor for difficult packaging materials »

Thursday 16th October 2014

World's first printable electronics material »

Thursday 16th October 2014

New Foundry Business for MEMS Utilizing Thin-Film Piezoelectric Elements »

Tuesday 14th October 2014

New Wafer Level RF Testing for E-band Semiconductor Products »

Monday 13th October 2014

Infineon completes syndication of €1.55 billion loan facilities for International Rectifier acquisition »

Monday 13th October 2014

New Hall system offers flexibility for non-destructive testing of wafer-scale materials »

Wednesday 8th October 2014

SUSS MicroTec Launches Wafer Bonder »

Tuesday 7th October 2014

EV Group Announces high-vacuum wafer bonding system »

Monday 6th October 2014

Mitsubishi and Tohoku University Develop Dual-Band Receiver Front-End Si-CMOS IC »

Friday 3rd October 2014

Lab and Fab

New technique offers prospect of silicon detectors for telecommunications »

Thursday 9th October 2014

Quick-change materials break silicon speed limit for computers »

Thursday 9th October 2014

New technology may lead to prolonged power in mobile devices »

Thursday 9th October 2014

New dimension for integrated circuits: 3-D nanomagnetic logic »

Thursday 9th October 2014

New generation of transient electronic devices »

Thursday 9th October 2014

Graphene looks promising as a flexible, low-cost touchscreen solution »

Thursday 9th October 2014

Technique offers prospect of silicon detectors for telecommunications »

Friday 3rd October 2014

Engineers unlock potential for faster computing »

Friday 3rd October 2014

Ultra-fast semiconductor nano-lasers »

Friday 3rd October 2014

UCSB scientists create silicon-based laser for DARPA »

Wednesday 17th September 2014

Beyond silicon, a new contender emerges »

Wednesday 17th September 2014

Luceda Photonics recieves finance for photonic IC design »

Tuesday 16th September 2014

Materials other than silicon for next generation electronic devices »

Friday 12th September 2014

New species of electrons can lead to better computing »

Friday 12th September 2014

Atomically seamless, thinnest-possible semiconductor junctions crafted by scientists »

Friday 12th September 2014

Layered graphene sandwich for a new generation of high frequency devices? »

Tuesday 9th September 2014

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