DISCO Corporation, semiconductor manufacturing equipment manufacturer, has developed DFP8141, a fully-automatic polisher which supports CMP (chemical mechanical polishing) of difficult-to-process materials including sapphire, SiC, LT, and LN. DFP8141 will be on display at SEMICON Japan 2016 (December 14 - 16 at Tokyo Big Sight).
The high-intensity LED market (in which growth is expected) requires a polishing process for device performance improvement after the backside grinding of the sapphire substrate on which the semiconductor device has been formed. With the increase in demand for saving energy, the need to polish SiC for power devices (for which demand is growing), LT (LiTaO3) for SAW filters, and LN (LiNbO3) has been increasing. To respond to this need,
DISCO has developed DFP8141, a fully-automatic single-spindle polisher which supports CMP for difficult-to-process small-diameter materials. DFP8141 offers processing solutions which were not available through DISCO’s lineup until now.