Orbotech selected by Huatian for 3D wafer-level packaging applications

Orbotech selected by Huatian for 3D wafer-level packaging applications »

ORBOTECH, a provider of process innovation technologies, solutions and equipment has announced that its Emerald Laser Via Formation system has been acquired by Huatian Technology (Kunshan) Electronics (Huatian) for its via formation in 3D wafer-level packaging (WLP) applications. Huatian Technology, a subsidiary of the Chinese IC test and packaging services company, TianShui Huatian Technology (TSHT), will use Orbotech’s Emerald system to achieve high-accuracy precision formation of <30µm holes through polyimide (PI) lined vias in 3D wafer-level packaging. Huatian selected Orbotech’s Emerald system to be its new process tool of record (PTOR), based on the product’s ability to enable Huatian to optimize production capabilities and reduce production costs.

Mr Aimo Xiao, CEO of Huatian stated, “Orbotech’s SPTS Technologies is a valued supplier and production partner of Huatian, and their PVD solutions continue to play a key role in the success of our CIS wafer-level packaging business. We believe that the Emerald system will enable us to explore new applications in this growing industry while remaining cost competitive with innovative solutions for our global customers.”

“This is a further example of Orbotech’s core technologies being leveraged for SPTS’ semiconductor customers. The demand for ever-smaller devices with more features and higher performance continues to drive the semiconductor industry to adopt innovative process solutions at a lower total cost of ownership,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “Huatian already employs our Sigma fxP PVD systems in their 300 mm CIS (CMOS image sensor) packaging lines. The addition of the Emerald laser drilling system to their CIS packaging lines will enable Huatian to improve their capabilities for small pitch CIS packaging schemes with a more reliable, more accurate and more cost-efficient through-hole via processing.”

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