Company News

STS Semi and Invensas to push bonding for mobile solutions »

O-Film signs $50 million agreement with Tessera »

SG Micro reveals novel HDMI interface device »

Mega Fluid Systems Celebrate Major Tool Shipment to USA Foundry »

Teknek Celebrates 20,000th Clean Machine »

New Technology Symposium to Highlight Critical Issues in Manufacturing »

Avantes launches highly sensitive system »

Diamond Innovations and Sandvik Hard Materials join forces »

Obducat reveals mass production lithography tool »

Frontier Silicon debuts multi integrated digital radio chip »

Vishay's 2512 size resistors offer power rating to 2 W »

Stuart Parkin wins Millennium Technology Prize for data storage »

AZ to boost Ormet's presence in packaging and circuit board markets »

Intel awards suppliers for outstanding services »

ATMI celebrates opening of South Korea production plant »

MACOM awards TowerJazz for supplier excellence »

ChipMOS quarterly revenues swell 12.9 percent »

O-ring manufacturing facility to support global growth »

Court confirms Camtek infringed Rudolph patent »

SiTime’s MEMS timing products replace legacy quartz »

GSA celebrates twenty years of semiconductor industry collaboration »

Innovation Village at SEMICON Europa 2014 »

Adesto reveals new serial Flash memory products »

CRI and Fairchild sign patent license agreement for DPA countermeasures »

AMAT veteran Fergus Clarke joins Picodeon as CEO »

Zeiss and NuFlare continue lithography collaboration »

TI awards twelve suppliers with annual excellence award »

SEMICON Singapore 2014 to focus on IoT »

Oerlikon unleashes new vacuum technology for R&D analysis »

Signetics still enhancing flip chip capacity »

AMD to spend $1.2 billion on GlobalFoundries' wafers »

Uvotech unveils new UV-Ozone cleaning tool »

SPTS awarded 'Company of the Year' by ESTnet »

IDT announces production availability of DDR4 memory »

Sankalp Semi wins ISO 9001:2008 certification »

SUSS MicroTec reveals mask aligner for 200mm »

ON Semiconductor awarded “Trusted Design” accreditation »

2.5D/3D packaging panel at the GSA Silicon Summit »

Analog Devices unveils ultra-low-power boost regulator »

Toshiba reveals application processors for wearable devices »

Crestone to distribute Alliance Memory modules in U.S. »

TowerJazz and Panasonic kick-off joint venture »

GE and NVIDIA to work on embedded computing chip »

Optomec advances packaging systems for printed electronics »

Tessera Tech and Qualcomm bury the hatchet »

Chief Financial Officer of STATS ChipPAC resigns »

Hamamatsu reveals silicon APDs with low bias operation »

Entegris prices $360million notes related to proposed ATMI acquisition »





Issue IV


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