Company News

Diamond Innovations and Sandvik Hard Materials join forces »

Obducat reveals mass production lithography tool »

Frontier Silicon debuts multi integrated digital radio chip »

Vishay's 2512 size resistors offer power rating to 2 W »

Stuart Parkin wins Millennium Technology Prize for data storage »

AZ to boost Ormet's presence in packaging and circuit board markets »

Intel awards suppliers for outstanding services »

ATMI celebrates opening of South Korea production plant »

MACOM awards TowerJazz for supplier excellence »

ChipMOS quarterly revenues swell 12.9 percent »

O-ring manufacturing facility to support global growth »

Court confirms Camtek infringed Rudolph patent »

SiTime’s MEMS timing products replace legacy quartz »

GSA celebrates twenty years of semiconductor industry collaboration »

Innovation Village at SEMICON Europa 2014 »

Adesto reveals new serial Flash memory products »

CRI and Fairchild sign patent license agreement for DPA countermeasures »

AMAT veteran Fergus Clarke joins Picodeon as CEO »

Zeiss and NuFlare continue lithography collaboration »

TI awards twelve suppliers with annual excellence award »

SEMICON Singapore 2014 to focus on IoT »

Oerlikon unleashes new vacuum technology for R&D analysis »

Signetics still enhancing flip chip capacity »

AMD to spend $1.2 billion on GlobalFoundries' wafers »

Uvotech unveils new UV-Ozone cleaning tool »

SPTS awarded 'Company of the Year' by ESTnet »

IDT announces production availability of DDR4 memory »

Sankalp Semi wins ISO 9001:2008 certification »

SUSS MicroTec reveals mask aligner for 200mm »

ON Semiconductor awarded “Trusted Design” accreditation »

2.5D/3D packaging panel at the GSA Silicon Summit »

Analog Devices unveils ultra-low-power boost regulator »

Toshiba reveals application processors for wearable devices »

Crestone to distribute Alliance Memory modules in U.S. »

TowerJazz and Panasonic kick-off joint venture »

GE and NVIDIA to work on embedded computing chip »

Optomec advances packaging systems for printed electronics »

Tessera Tech and Qualcomm bury the hatchet »

Chief Financial Officer of STATS ChipPAC resigns »

Hamamatsu reveals silicon APDs with low bias operation »

Entegris prices $360million notes related to proposed ATMI acquisition »

Tessera announces letter of intent with O-Film »

Nujira champions future stars of electronics industry »

Smart Modular launches DDR4 DRAM module for computing »

IPG announces configurable fibre laser workstation »

Synopsys acquires Coverity for $334 million »

Toshiba shipping IC samples for automotive applications »

TI unveils MOSFETs for high-current motor control and power designs »





Issue III


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