Company News

Advantest wins order from IC maker HiSilicon »

Toshiba launches 600V MOSFET DTMOS IV-H series »

Tessera and Renesas make amends »

Wacker Chemie reaches polysilicon agreement with China »

Yamaha and Cadence halve leakage power in smartphones »

SEMI awards SMIC CEO TY Chiu »

EVG establishes China headquarters in Shanghai »

MEMS startup Qualtré secures $8 million strategic round »

Micron wins three patent victories against the University of Illinois »

TSMC upgrades financial guidance »

EV Group Boosts 2.5D And 3D-IC/TSV Performance On Photoresist Processing System »

Samsung mass producing 4Gb DDR3 chips with 20nm technology »

Akustica’s MEMS microphones target smartphones and wearables »

‘MEMS and NEMS processing advances’ workshop »

Molex to showcase silicon based MXC fibre optic interface technology »

Mellanox's silicon photonics speeds up communication »

Entropic and MTI deploy switch technology in the middle east »

RheoSense to bring Malvern MEMS to industrial markets »

Vishay launches silicon and AlGaAs IR emitters/photodiodes »

Minnesota university's Sapatnekar honoured by SIA »

Silicon Motion wins Korean handset OEM order for transceiver »

Power Integrations awarded $105 million from Fairchild »

X-FAB Announces Double-Digit Sales Growth in 2013 »

Ex Dell VP appointed to Flash out memory at Micron »

Serus aims to revolutionise high tech manufacturing »

SiOnyx initiates Black Silicon XQE License program »

Vishay releases first ThunderFET MOSFETs »

SUSS MicroTec launch Projection Scanner for Advanced Packaging »

SEMICON Europa has a new agenda »

Sentech sells ALD system to Chinese university »

CMOSIS shows off high speed, high resolution image sensor »

Towa inaugurates packaging centre in Netherlands »

MACOM launches high power silicon PIN switch »

Intermolecular deepens SanDisk/Toshiba relationship »

Alliance Memory introduces high-speed CMOS DDR SDRAMs »

Craic develops thin film thickness software for sub-micron sampling »

IDC: Rapid growth In smartphones offsets weak feature phone revenues »

Rudolph reports record installations for semiconductor software »

Toshiba sending samples of low power ICs for Bluetooth »

Aselta optimises Mapper’s maskless lithography »

TI introduces a new sort of integrated logic gate device »

Frost & Sullivan: RFaxis' silicon FEM devices kick GaAs »

Fujitsu expands its memory range »

Thales and UKESF to attract UK’s youngsters into engineering »

Nujira speeds up envelope tracking adoption »

Honeywell's CuMn sputterers lengthen device lifetime »

Toshiba's SSDs integrate NAND chips fabricated with 19nm process »

ITC compensated over red-nosed Rudolph »





Issue III


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