Company News

Boston Semi Equipment Expands Sales and Service Organization »

New NCP Material Enables Next-Generation Flip-Chip Devices »

HuaTian Technologies Chooses SPTS PVD Solution for new 300mm Expansion »

SEMICON West: memsstar Launches Next-Generation MEMS Equipment »

SUSS MicroTec Launches Excimer Laser Debonder for 3D-Integration »

M+W Group sells its Automation Business »

SMIC and Qualcomm Collaborate on 28nm Wafer Production in China »

SEMICON West: KLA-Tencor Reveals Inspection and Review Portfolio »

Applied Materials Introduces CVD and CMP Systems for 3D Architectures »

2D plenary sessions launch ‘Nanotechnology Seminar’ in Beijing »

MEMS aids Yokogawa & GasSecure agreement for safety »

Ushio tools meet challenges in major packaging applications »

IR broadens 60V StrongIRFET MOSFET portfolio »

Renesas and Acacia Research strengthen patent partnership »

Compact MEMS gyro measures angular velocity in harsh environments »

Jordan Valley's wafer level packaging market share boosted »

ASMPT completes DEK acquisition »

Alpha and Omega unveils new series of 3x3mm 25V and 30V MOSFETs »

Vishay expands thick film chip resistors series »

Roth & Rau - Ortner reveals FOUP purge system »

HiSilicon cuts costs with Arteris interconnect fabric IP »

Multiple Trymax NEO resist removal and descum systems sold »

Silicon Labs' digital isolators beat optocouplers »

eSilicon Takes Amar Hanspal On Board »

Alpha Opens New Die Attach Applications Centre in Germany »

New Multi-Gauge Controller from Kurt J. Lesker Company »

SEMI and SST announce 2014 “Best of West” award finalists »

Inpria bags $1.45 million to accelerate technology development »

Coventor enhances MEMS design software »

CEA-Leti and Corima to develop MEMS sensors for cycles »

EV Group makes 3D-IC/TSV high-volume manufacturing one step closer »

Sonoscan unveils MEMS inspection system »

Nordson reveals fluid dispensing system for cleanrooms »

Rick Tsai joins NXP as non-executive director »

mCube secures $37million Series C financing round »

Alliance Memory launches high-speed CMOS DDR3 SDRAMs »

Bosch ships 4 billion MEMS sensors »

SMART Modular shipping samples of DDR4 memory modules »

Koh Young to unveil 3D measurement for semiconductor applications »

MEMSIC broadens high-performance IMU solution portfolio »

Dialog Semiconductor AMS AG discuss merger »

Rohm reveals compact wearable key device »

PNI gives smartphone OEMs low power ‘sensor hub’ »

Copper analyser monitors electronics manufacturing wastewater treatment »

The growth of Swindon Silicon »

Legacy and Samsung Techwin to expand manufacturing capacity »

Analog Devices kicks off tender offer to buy out Hittite shares »

Lam Research Foundation Donates $1 Million to Six Global Charities »





Issue IV


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