Company News

Novati gets 'trusted foundry' stamp for US defence applications »

Europe sees semiconductor surge »

RFMD's revenue grows to record level »

Panasonic and Tesla Sign Agreement for the Gigafactory »

Agilent's measurement business starts trading as Keysight Technologies »

New flex material to reduce product waste »

Durex Industries sets up Singapore office »

Freescale Hit Two-Billionth Sensor and announce new accelerometer »

KLA-Tencor Reports Q4 And Full Year Results »

Watlow Temperature Control Device to Pass Conformance Testing »

Imec demonstrates 28Gb/s photonics platform »

TRUMPF Sales Exceed 2.5 Billion for the First Time »

Microsemi Acquires Mingoa »

High-precision positioning of wafers in inspection systems »

CNE cleanroom certified in "first" 300mm fab in Russia »

XMOS in the money with big new investors »

RFaxis ramps up production of broadband Sub-GHz CMOS RFeIC »

Providing high dynamical positioning for semiconductors »

DEK Signs New VectorGuard License Agreement with Sunshine Laser »

Swedish Plant Replaces Oil Sealed Vacuum Pumps with Edwards’ Dry Technology »

IBM Announces $3 Billion Research Initiative To Tackle Chip Challenges »

New Tool Integrates Dielectric Etch and Photoresist Strip Chambers »

Veeco Partners With Software Solutions Provider Rudolph Technologies »

Escatec celebrates thirty years in electronics »

Advantest Test Platform to Address Growing Integration Trend in SoC Market »

SEMICON West: Entegris Launches Ultra Clean Filter for Semiconductor Manufacturing »

Nanotechnology merger - temicon and holotools join forces »

Boston Semi Equipment Expands Sales and Service Organization »

New NCP Material Enables Next-Generation Flip-Chip Devices »

HuaTian Technologies Chooses SPTS PVD Solution for new 300mm Expansion »

SEMICON West: memsstar Launches Next-Generation MEMS Equipment »

SUSS MicroTec Launches Excimer Laser Debonder for 3D-Integration »

M+W Group sells its Automation Business »

SMIC and Qualcomm Collaborate on 28nm Wafer Production in China »

SEMICON West: KLA-Tencor Reveals Inspection and Review Portfolio »

Applied Materials Introduces CVD and CMP Systems for 3D Architectures »

2D plenary sessions launch ‘Nanotechnology Seminar’ in Beijing »

MEMS aids Yokogawa & GasSecure agreement for safety »

Ushio tools meet challenges in major packaging applications »

IR broadens 60V StrongIRFET MOSFET portfolio »

Renesas and Acacia Research strengthen patent partnership »

Compact MEMS gyro measures angular velocity in harsh environments »

Jordan Valley's wafer level packaging market share boosted »

ASMPT completes DEK acquisition »

Alpha and Omega unveils new series of 3x3mm 25V and 30V MOSFETs »

Vishay expands thick film chip resistors series »

Roth & Rau - Ortner reveals FOUP purge system »

HiSilicon cuts costs with Arteris interconnect fabric IP »





Issue V


Issue V


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