Company News

Sonoscan unveils MEMS inspection system »

Nordson reveals fluid dispensing system for cleanrooms »

Rick Tsai joins NXP as non-executive director »

mCube secures $37million Series C financing round »

Alliance Memory launches high-speed CMOS DDR3 SDRAMs »

Bosch ships 4 billion MEMS sensors »

SMART Modular shipping samples of DDR4 memory modules »

Koh Young to unveil 3D measurement for semiconductor applications »

MEMSIC broadens high-performance IMU solution portfolio »

Dialog Semiconductor AMS AG discuss merger »

Rohm reveals compact wearable key device »

PNI gives smartphone OEMs low power ‘sensor hub’ »

Copper analyser monitors electronics manufacturing wastewater treatment »

The growth of Swindon Silicon »

Legacy and Samsung Techwin to expand manufacturing capacity »

Analog Devices kicks off tender offer to buy out Hittite shares »

Lam Research Foundation Donates $1 Million to Six Global Charities »

ZEISS launches next generation photomask qualification system »

Agilent advances modelling for 3D FinFETs »

X-FAB to exhibit 3-Axis MEMS inertial sensor technology »

GigOptix to acquire Tahoe RF Semiconductor »

GS Nanotech pioneers 3D packaging technology in Russia »

X-FAB Expands MEMS Manufacturing Capabilities »

New Entegris Centre Focuses on Manufacturing and R&D of Filtration Membranes and Specialty Coatings »

Electrostatic discharge could become a thing of the past with new material »

Infineon has shipped one billion RF switches for smartphones and tablets »

memsstar relocates and increases manufacturing capacity by 40% »

Boston Semi Equipment Acquires MVTS Technologies »

Fujian Jiuce Installs SAES Pure Gas Palladium Hydrogen Purifier »

Cadence acquires Jasper Design Automation »

Lam Research Foundation donates $1 million to six charities »

Intel pays INSIDE Secure $19.2 million »

Unisem to expand testing capacity »

Analog Devices welcomes ex Apple VP to the Board »

Kingyoup and IBM develop wafer bonding & debonding tool »

Intel loses challenge against €1.06 billion fine »

X-FAB first to buy LatticeAx 300 cleaving tool »

Akros Silicon to present developments on power systems »

Rambus signs agreement with Qualcomm »

Applied Ventures Broadens Portfolio with Biotechnology Investment »

Lam and imec expand processing partnership »

TI expands three-phase smart e-meter SoC line »

Fraunhofer IPMS enhances ultrasonic sensors »

Ichor Systems triples semi manufacturing capacity »

MACOM named a ‘Trusted Foundry’ by DoD »

Intel veteran to represent Soitec in North America »

Scaleo chip develops first of a kind automotive MCU »

ams to acquire AppliedSensor »





Issue IV


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