Industry News

A tough coat for silicon »

Ultratech receives multiple orders for laser spike annealing systems »

Ulvac launches dry etching system for advanced packaging substrate »

NXP Delivers Framework for Innovators Developing Novel and Secure IoT Applications »

Panasonic and launch IoT research project based on Infrared array sensor »

Linde invests over EUR 110 million in China to strengthen position »

Atlas Copco Appoints New Semiconductor Divisions Presidents »

Nano Dimension Supplies 3D Printer to Syqe Medical »

First automotive control unit with field-programmable logic announced »

Globalfoundries to Demonstrate 56G Long-Reach SerDes at OFC 2017 »

Unitysc Announce New Nanotopography Metrology Platform »

Wet process innovations await at AP&S booth at Semicon China »

DISCO Receives Intel's Preferred Quality Supplier Award »

EVG breaks speed and accuracy barrier in mask alignment lithography for advanced packaging »

Fujitsu sensor beacons with Wirepas connectivity offer an easy-to-use IoT module »

German companies and research institutes optimize security solutions for Industrie 4.0 »

Semtech Ships 20 Billionth Protection Device for Mobile Applications »

SII Semiconductor Introduces New 2-to-4-Cell Lithium-Ion Battery Second Protection ICs »

Wet process innovations at the AP&S booth at Semicon China »

PCAS invests to increase manufacturing capacities of electronic polymers »

Competition in the Chinese mobile SoC market is growing »

ASM Recieves Supplier Excellence Award from TSMC »

MEMS Manufacturer Selects ULVAC Technologies, Plasma Ashing System »

SMIC Joins Ebeam Initiative as EUV Lithography And Multi-Beam Mask Writing Become Key »

Texas Instruments joins CharIN to drive innovation in electric vehicle charging »

MediaTek announces mass production of X30, Helio moves to 10nm »

Infineon and XMOS partner to enable better voice recognition »

Gemalto accelerate IoT innovation with new rapid prototyping tool »

Anritsu Collaborates with KDDI on IoT Lab Tests »

First 22 nm FD-SOI Silicon SoC from Dream Chip »

Renesas acquisition of Intersil complete »

A step closer to High Volume Manufacturing Including EUVL »

SEMICON Southeast Asia 2017 World of IoT »

DC-DC regulator reduces component count »

New iPhones to Drive NAND Flash Demand in This Year’s Second Half »

Tessera Announces Name Change to Xperi »

Yokogawa launches power analyser dedicated to transformer testing »

Leti to Present Latest R&D Results On Alternatives to EUV And 193 nm Lithography »

Reducing energy losses in power grids and electric devices by half »

Final Regulatory Approval for Renesas Acquisition of Intersil »

Oerlikon signs two research partnerships to advance industrialisation of additive manufacturing »

GLOBALFOUNDRIES Announces Availability of 45 nm RF SOI to Advance 5G Mobile Communications »

Analog Devices first to offer automotive RADAR technology »

Flemish Government increases financial support of imec »

Versatile Accelerometer from STMicroelectronics »

Remote Patient Monitoring Revenues to Reach € 32.4 Billion in 2021 »

GE Presents New Industrial Internet Control System »

Leti Announces Project to Adapt Obstacle-Detection Technology Used in Autonomous Cars »





Issue V


Issue V


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