Industry News

Fitch: Qualcomm/NXP Deal Underscores Semiconductor Merger Trend »

Analog Devices Acquires Innovasic »

Qualcomm acquisition of NXP combines automotive force with new frontier power »

Power Electronics Powered by Batch Aluminium Nitride »

ASML and LLNL to Develop Extreme EUV Chip Manufacturing »

Air Liquide signs a major contract with China’s leading display manufacturer »

Air Liquide continues investing in Asia »

Infineon fuels automated driving and electromobility »

Infineon is back on Mars »

SICK double sheet detector could save electronics industry production jams »

Infineon IGBTs optimized for low switching and conduction losses »

Sensors and measurement on the upswing »

Air Liquide continues innovating with new family of etch materials »

Qualcomm Files Complaint against Meizu in China »

Peregrine Semiconductor Wins 2016 ECN IMPACT Award »

Düsseldorf Court grants preliminary injunction against Mouser »

Murata to acquire IPDiA »

Smart meter shipments in Europe will grow 105 percent until 2018 »

Infineon acquire Innoluce BV »

Veeco announces reduction in ALD technology investments »

Lam Research, KLA-Tenor scrap merger due to antitrust worries »

X-FAB Strengthens Position in High Volume SiC production »

CNR-IMM Italy uses SENTECH SI PEALD system for new high-k materials »

X-FAB to acquire assets of Altis Semiconductor »

INVECAS, Globalfoundries Announce Advanced 14nm FinFET Design IP Library »

Applied Materials to grow in 3DNAND, Logic and Materials based patterning »

Picosun Patents ALD Nanolaminate to Prevent Electronics from Overheating »

Spin Transfer Technologies Develop 20 nm Magnetic Tunnel Junction MRAM »

Nordson MARCH’s Plasma Confinement Ring Increases Etch Rate »

Renesas Delivers Contactless Wireless Charging for Healthcare and Wearable Devices »

EV Group Extends Volume Manufacturing Expertise to Biotechnology and Medical Device Applications »

Applied Materials and A*STAR’s Institute of Microelectronics to Advance R&D in Fan-Out Wafer-Level Packaging »

Applied Materials Brings its E-Beam Review Technology to the Display Industry »

Cascade Microtech Introduces Wafer-level Electromigration Test System »

World’s First Frequency Selectable RF Power Sensor »

Dialog Semiconductor Announce Latest Bluetooth SoC »

Gemalto and Valeo partner to turn smartphone into a secure car key »

Kulicke & Soffa Launches Enhanced Capability Hybrid Wedge Bonder »

WISeKey Completes the Acquisition of INSIDE Secure Semiconductor Business »

WiTricity and Prodrive Technologies to Develop 11 kW EV Wireless Charging System »

Toshiba Expands 24nm SLC NAND Flash Lineup to Address Industrial Applications »

Leti Orders Hercules Nil System from EV Group »

Globalfoundries to Deliver 7nm FinFET Technology »

UltraSoC supports RISC-V »

Dreamweaver Launches 20 Micron Nonwoven Separator for Ultra-Safe Lithium Ion Batteries »

Diamond proves useful material for growing graphene »

Global Semiconductor Sales Rebound in July »

New chip manufacturing method squeezes more onto limited wafer space »

PARTNERS

MEDIA SPONSOR

http://www.techweekeurope.co.uk/

CURRENT ISSUE

 

Issue III

PARTNERS

Latest Jobs

Production Engineer »

Anvil Semiconductors

Semiconductor Materials Development Engineer »

Anvil Semiconductors

Show Partners