Industry News

Ultratech receives multiple orders for fan-out wafer-level packaging applications »

Intersil 12-Cell Li-ion Battery Pack Monitor Safeguards Hybrid and EV Battery Systems »

Ultratech Receives Follow-On Order From Major Asian Foundry For Annealing System »

EV GROUP achieves top scores in VLSIresearch satisfaction survey »

GE Completes Domestic Compliance for Solar and Wind Inverters in Brazil »

NXP Semiconductors to Divest its Standard Products Business »

Axus introduces new PCB planarization tool »

Leti Extends CMOS Platforms’ Lifespan »

Novel Bifacial Cell Technology to Enhance Energy Yield of PV modules »

ASML to acquire HMI to enhance lithography portfolio »

Cambridge CMOS Sensors acquired by ams »

NanoFocus announce new process tool for the inspection of probe cards »

FEI Enhances DualBeam with New Slice & View Software »

Bruker tool detects oxygen in silicon ingots »

EU project helps boost “organic” electronics »

Nordson DAGE opens Asian clean room demonstration facility »

Air Products to Spin-Off Electronic Materials Division »

Meyer Burger awarded CHF 10 million contract for its diamond wire saws »

Exar to Sell its iML Subsidiary for $136 Million »

Gold savings can pay back equipment cost within a year? »

Sungrow and ABB Enter Strategic Collaboration in 1500-Volt Solar Market »

ASE proposes acquisition of SPIL »

Industrial semiconductor revenues rose slightly in 2015 »

NanoFocus introduces new inspection system »

New technology reduces chip area of STT-MRAM while increasing memory bit yield »

Synopsys Launches Pre-Wafer Simulation Solution »

Tessera files legal proceedings against Broadcom for patent infringement »

Imec and Holst present multi-standard low-power wide-area radio chip »

Soitec announces withdrawal of Silicon Genesis patent lawsuit »

SUSS MicroTec Launches Operator-Assisted Surface Laser Imagers »

Porvair Filtration Group installs state-of-the art clean room at Caribou plant »

MiniSKiiP meets half-bridge in Vincotech new line »

Vincotech reveal hree-level topology for solar applications »

Fairchild Launches New Discrete and Bare Die IGBTs for Hybrid and All-Electric Vehicles »

Imec expands silicon platform for quantum computing applications »

Semiconductor suppliers show double-digit declines 1Q16 »

Brewer Science joins NextFlex as a founding member »

Semiconductor Devices selects Veeco for production of infrared detectors »

Exagan and TÜV collaborate to develop, industrialise and qualify GaN-on-silicon »

EV Group receives multiple orders for bonder for 3D chip stacking production applications »

Rudolph Technologies appoints new VP of Global Customer Operations »

Kulicke & Soffa to participate at PCIM Europe 2016 »

Maturing smartphone market signals falling growth for wireless semiconductors »

Infineon unveils CoolSiC MOSFETs »

Allegro MicroSystems Europe introduces new 1MHz bandwidth, integrated Hall-effect based current sensor IC »

UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions »

Imec reports 14 percent growth in 2015 »

M+W Group wins prestigious SMIC Supplier of the Year Award »





Issue II


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