Industry News

Automotive MEMS Sensor Unit-Shipments Rose in 2015 »

Successful demonstration of nonvolatile memory sub-nanosecond operation good news for IoT »

Advantest Showcase Broad Spectrum of Semiconductor Test Solutions at SEMICON West »

A*STAR’s IME launches consortia to address key challenges in wafer-level packaging »

Perfectly formed memory »

IC Insights Lowers Its 2016 Semiconductor Market Forecast to -1 percent »

PMS announce 20 nm chemical particle counter »

Graphene could revolutionise the internet of things »

New synchronous rectification ICs for SMPS applications »

ON Semiconductor Extends Tender Offer to Acquire Fairchild Semiconductor »

LETI develops 3D network-on-chip to Improve high-performance computing »

New power electronics centre at FAU funded with 1.5 million euros »

KLA-Tencor Introduces wafer inspection and review systems »

Tanaka Kikinzoku Kogyo K.K acquires shares of Metalor Technologies »

Picosun and University of Helsinki Shed New Light on ALD »

New High-Speed EtherCAT Mass Flow Controllers from Brooks Instrument »

Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection »

Orbotech Inkjet 600 elected by Amkor Technology for system-in-package applications »

EV GROUP rolls out automated metrology system for advanced packaging, mems and photonics manufacturing »

Imec Expands with opening of imec Florida »

Electronic Gases Market Undergoing Major Shifts »

Parker Introduces New Pressure-Reducing Regulators »

Averna Acquires US-Based Nexjen Systems »

EV GROUP expands high-vacuum wafer bonding capabilities for MEMS »

TDK to Preview Equipment Front End Module at SEMICON West 2016 »

Macronix Selected as Key Flash Memory Supplier for Siemens »

SMIC Acquires LFoundry and Enters into Global Automotive Electronics Market »

ROFIN-SINAR Stockholders Approve Acquisition By Coherent »

AMICRA to Provide Precision Die Attach System to Fabrinet in Silicon Valley »

Growth in electric vehicles sales central to closing emissions gap »

Rudolph Receives System Order Over $11 Million »

Ultratech receives multiple orders for fan-out wafer-level packaging applications »

Intersil 12-Cell Li-ion Battery Pack Monitor Safeguards Hybrid and EV Battery Systems »

Ultratech Receives Follow-On Order From Major Asian Foundry For Annealing System »

EV GROUP achieves top scores in VLSIresearch satisfaction survey »

GE Completes Domestic Compliance for Solar and Wind Inverters in Brazil »

NXP Semiconductors to Divest its Standard Products Business »

Axus introduces new PCB planarization tool »

Leti Extends CMOS Platforms’ Lifespan »

Novel Bifacial Cell Technology to Enhance Energy Yield of PV modules »

ASML to acquire HMI to enhance lithography portfolio »

Cambridge CMOS Sensors acquired by ams »

NanoFocus announce new process tool for the inspection of probe cards »

NXP Semiconductors to Divest its Standard Products Business »

FEI Enhances DualBeam with New Slice & View Software »

Bruker tool detects oxygen in silicon ingots »

EU project helps boost “organic” electronics »

Nordson DAGE opens Asian clean room demonstration facility »





Issue V


Issue V


Show Partners