Customer 1st to supply Alliance Memory SRAMs and DRAMs in U.S. »

Advanced Energy highlights pulsing technology for 2X/1X nm »

Toshiba develops eXtremely low leakage SRAM technology »

Berliner Glas manufactures super-flat wafer chucks »

Imec and Holst Centre develop low-power ECG-acquisition chip »

Andor joins Oxford Instruments to spur growth »

Ultrasonic Systems launches next generation coating tools »

Zygo wins $3 million metrology order »

CEA-Leti acquires Rudolph's new TSV metrology system »

Ecsatec appoints new head of global R&D team »

EVG enhances memory photoresist manufacturing »

IGBT market worth $6.48 billion »

Kevin Crofton promoted to president at SPTS »

Electronics: Graphene on SiC takes on silicon »

Spintronics advances with vanadium dioxide on silicon »

SWS’ MEMS FTIR spectrometer wins Prism award »

IHS: Industrial electronic chip market escalates in 2013 »

Gartner : PC market dwindles in Western Europe »

Extending Moore's law with III-Vs »

Entegris will acquire ATMI »

iPhone 5 integrates three MEMS microphones »

Advantest tool tests DDR4 and LPDDR4 memories »

Atom-by-atom simulation of ALD nanoscale film growth »

Peregrine reconfigurable RF front-end system takes on GaAs »

Quantum Computers: Defects could be diamond's best friend »

JDSU reveals new laser technology for materials processing »

IC Insights: 300mm capacity expansion dominates »

Zygo 3D optical profiler enhances surface metrology »

BMC's MEMS mirror used in Gemini planet imager »

Ethertronics reveals first antenna tuning chips with embedded memory »

STS acquires IBM tools and technology license »

Rudolph wins $11 million lithography orders »

Excelitas expands silicon enhanced APD line »

SIA: Semiconductor sales break barriers in 2013 »

SEMI: Capital spending booming in Korea »

Oxford Instruments to host MEMS and NEMS seminar »

IC Insights: Top thirteen foundries monopolise sales in 2013 »

Graphene challenges silicon for mobile devices »

Yole: CMOS image sensor market to hit $13 billion »

SUSS, IBM collaborate on Advanced Packaging and 3D Integration »

Presto, DelfMEMS to Design RF MEMS Test Solution »

Good news for Ultra Clean as 2013 Revenues revised upwardly »

Pfeiffer Vacuum Presents New series of dry pumps »

Computing with silicon neurons »

Oerlikon Leybold Vacuum moves to Cologne logistics centre »

IHS: 4G smartphone market in China set to rocket »

Renesas to transfer semiconductor manufacturing plant to Sony »

Murata unveils capacitive type MEMS pressure sensor »





Issue V


Issue V


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