X-FAB to acquire assets of Altis Semiconductor »

Veeco to cut back Atomic Layer Deposition developments »

Pfeiffer Vacuum introduces new magnetically coupled rotary vane pump »

INVECAS, Globalfoundries Announce Advanced 14nm FinFET Design IP Library »

Applied Materials to grow in 3DNAND, Logic and Materials based patterning »

Picosun Patents ALD Nanolaminate to Prevent Electronics from Overheating »

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies »

Spin Transfer Technologies Develop 20 nm Magnetic Tunnel Junction MRAM »

Nordson MARCH’s Plasma Confinement Ring Increases Etch Rate »

Renesas Delivers Contactless Wireless Charging for Healthcare and Wearable Devices »

EV Group Extends Volume Manufacturing Expertise to Biotechnology and Medical Device Applications »

Applied Materials and A*STAR’s Institute of Microelectronics to Advance R&D in Fan-Out Wafer-Level Packaging »

Applied Materials Brings its E-Beam Review Technology to the Display Industry »

Cascade Microtech Introduces Wafer-level Electromigration Test System »

World’s First Frequency Selectable RF Power Sensor »

Oxford Instruments is ‘Bringing the Nanoworld Together’ in India »

Dialog Semiconductor Announce Latest Bluetooth SoC »

Gemalto and Valeo Partner to Turn Smartphone into a Secure Car Key »

Kulicke & Soffa Launches Enhanced Capability Hybrid Wedge Bonder »

WISeKey Completes the Acquisition of INSIDE Secure Semiconductor Business »

WiTricity and Prodrive Technologies to Develop 11 kW EV Wireless Charging System »

Good news for Critical Manufacturing MES »

Toshiba Expands 24nm SLC NAND Flash Lineup to Address Industrial Applications »

Leti Orders Hercules Nil System from EV Group »

Globalfoundries to Deliver 7nm FinFET Technology »

UltraSoC supports RISC-V »

Dreamweaver Launches 20 Micron Nonwoven Separator for Ultra-Safe Lithium Ion Batteries »

Diamond proves useful material for growing graphene »

Global Semiconductor Sales Rebound in July »

New chip manufacturing method squeezes more onto limited wafer space »

For first time, carbon nanotube transistors outperform silicon »

Asia-Pacific Tops 2016 Regional IC Sales In Major System Categories »

Von Ardenne Supplies Fraunhofer IPMS with Cluster System For MEMS Fabrication »

Printable Batteries Could Power the IoT »

IBM and ARM Collaborate to Accelerate Delivery of Internet of Things »

Praxair and Linde Terminate Talks about Merger »

KJLC Announces Exclusive Partnership with Brooks Automation »

IXYS Announces 850V Ultra-Junction X-Class Power MOSFETs »

Trelleborg Acquires Anderson Seal »

MosChip Announce Acquisition of Three companies to Expand IoT Opportunities »

Imec scientist awarded ERC Grant to develop breakthrough flexible electronics »

Electrons at the speed limit »

SEMI Reports Second Quarter 2016 Worldwide Billings $10.5 Billion »

CommSolid Secures Funding for its NarrowBand-IoT Product Development »

Renesas to Acquire Intersil »

Qualcomm Opens test facility in Shanghai for Semiconductor Test Manufacturing »

Process Interfaces for Hiden Gas Analysers »

Evince secures £0.75 million of new investment for breakthrough diamond-based electronics »





Issue V


Issue V


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