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Industry News
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AI investment expected to drive semiconductor industry past $2 trillion by 2027
Electronic Design Automation market size worth $43.07 billion by 2034
New EU Photonics roadmap warns Europe cannot take its technological lead for granted
EU photonics leadership must not be taken for granted
The FAMES payoff begins
Presto Engineering and Menta announce collaboration
Europe acts with RESOLVE
DTU Nanolab expands silicon DRIE infrastructure with cassette-loading etch system from Samco
UK silicon photonics sector poised for landmark growth
imec presents quantum dot qubit device using High NA EUV lithography
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Technical Insight
Shifting supply chains in the era of photonics
Beyond High-NA EUV: Particle accelerator technology promises exciting future for lithography
Optimising SiCr deposition for high-yield bipolar-CMOS-DMOS manufacturing with picosecond ultrasonics
Why new developments in MEMS are fundamental for next-generation devices
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Renesas acquires Pictorus
CEA-Leti scales ferroelectric RAM to 22nm node
ASML, TSMC and imec bring industry-ready 2D-material transistors closer
Veeco receives follow-on order for Nanosecond Annealing System
Photon Design adds silicon modulator design capability
Presto Engineering and Menta form strategic collaboration
Constant gas pressure, even with extremely fluctuating consumption
Teradyne introduces integrated test solution for AI and data centre devices
NVIDIA and SK hynix form multiyear technology partnership
Cadence unveils Autonomous Virtual Engineer for chip design
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Analyst and Vendor Views
Pfeiffer Vacuum+Fab Solutions to Showcase Semiconductor Solutions at SEMICON Southeast Asia 2026
Sintered sinthetic cristoblate
Ensuring the reliable and long-lasting operation of cutting-edge semiconductor fabrication with thermoplastic pipe stress analysis
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
Analyst and Vendor Views
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TDLAS vs CRDS: Which gas analysis technology truly performs in the fab?
Reinventing engineering for the Age of AI
FAMES completes the first exchange of ferroelectric memory wafers
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